Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more