Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. read more
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more