Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more