Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
A Second Look At Injection Via Fill Process Capability,And Material Property Issues
In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package
manufacturing. The current corporate mandate is to develop advanced,enablin
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
A Second Look At Injection Via Fill Process Capability,And Material Property Issues
In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package
manufacturing. The current corporate mandate is to develop advanced,enablin
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more