Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Vibration Testing of Harsh Environment Solder Alloys
Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Vibration Testing of Harsh Environment Solder Alloys
Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more