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A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Optimization of PCB SI Coupon Design that Minimizes Discontinuity through Via-In-Pad Plated Over (VIPPO) Technique
The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t
.. read more
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. read more
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Optimization of PCB SI Coupon Design that Minimizes Discontinuity through Via-In-Pad Plated Over (VIPPO) Technique
The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t
.. read more
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. read more