Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. read more
Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis
Thermo-gravimetric Analysis (TGA) measures weight changes in a material as a function of temperature (or time) under a controlled atmosphere. This technique is currently used in the design phas
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. read more
Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis
Thermo-gravimetric Analysis (TGA) measures weight changes in a material as a function of temperature (or time) under a controlled atmosphere. This technique is currently used in the design phas
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more