Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more