Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
.. read more
Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more
Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
.. read more
Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more