Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more