Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. read more
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Lead free Defects and Process Yields – Real Case Studies on How Assemblers are preventing them and Maintaining Yields
The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical
properties of lead-free solder alloys,transitioning lead-free soldering with
.. read more
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. read more
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Lead free Defects and Process Yields – Real Case Studies on How Assemblers are preventing them and Maintaining Yields
The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical
properties of lead-free solder alloys,transitioning lead-free soldering with
.. read more
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. read more