Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. read more
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. read more
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more