Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation
The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products
mandate the enhancement of manufacturing systems and assembly yields. In fine pit
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation
The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products
mandate the enhancement of manufacturing systems and assembly yields. In fine pit
.. read more