Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. read more
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. read more
Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. read more
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. read more
Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more