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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more