Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
The Study of the Nitrogen Effect for Wave Soldering Process
Recently,with significant increasing of solder manufacturing cost due to raw materials,electronics makers are also faced with the same difficulty. And they are finding solutions that save cost
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. read more
Eliminating Wave Solder Waste with Automatic Dross Reclamation
Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks
to the Wave Soldering process is the high cost associated with maintaining and o
.. read more
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
Hot nitrogen for wave soldering
- Hot nitrogen technology for local inerting system of wave
soldering machines has proved to give significant advantages with Tin Lead or Lead free solders:
- Better heat transfer on the PCBs,e
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
The Study of the Nitrogen Effect for Wave Soldering Process
Recently,with significant increasing of solder manufacturing cost due to raw materials,electronics makers are also faced with the same difficulty. And they are finding solutions that save cost
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. read more
Eliminating Wave Solder Waste with Automatic Dross Reclamation
Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks
to the Wave Soldering process is the high cost associated with maintaining and o
.. read more