Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more