Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more