Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Optical Switch Packaging Wire-bonding and Encapsulation Approaches
The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over
extended distances in the optical domain,without the need for power-hungry and ba
.. read more
Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Optical Switch Packaging Wire-bonding and Encapsulation Approaches
The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over
extended distances in the optical domain,without the need for power-hungry and ba
.. read more