Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. read more
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. read more