Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more