Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools
Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual
adhesive deposits were inspected for strings or tails,extra dots,missing dots
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools
Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual
adhesive deposits were inspected for strings or tails,extra dots,missing dots
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more