Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more