Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
EWPTE 2026 Demonstrates Continued Industry Growth with More Than 3,100 Total Participants
The 2026 Electrical Wire Processing Technology Expo (EWPTE) brought together the cable and wire harness manufacturing industry for another strong year of innovation, education, and business development, drawing 3,140 total participants to Milwaukee.
Global Electronics Association and FED Call for Abstracts for Pan-European Electronics Design Conference 2027
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
On March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
APEX EXPO 2026 Show Floor Sells Out – 416 Exhibitors – Largest Manufacturer Lineup in Six Years
The APEX EXPO 2026 show floor has officially sold out, with 416 exhibitors occupying the Anaheim Convention Center.
Best Technical Paper Awards Showcased at APEX EXPO 2026
The Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.