IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

The 48th WorldSkills Competition was held in Shanghai from September 22 to 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

MIT’s Yossi Sheffi to Headline Global Electronics Association APEX EXPO 2027

Largest North American electronics trade fair welcomes Dr. Sheffi to drive conversations on AI, resilience, geopolitics and their impact on current and future state of electronics

The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.

WHMA Announces 2027 Annual Global Leadership Summit for Wire Harness Industry Leaders

Registration now open for WHMA’s premier event focused on workforce, automation, AI and the economic forces shaping the wire harness industry

The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.

Winners of Hand Soldering Competition Vietnam 2026 Announced

The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.

Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

Advanced Electronic Packaging Conference 2027 Component-to-System-Level Integration

The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.

EWPTE 2026 Demonstrates Continued Industry Growth with More Than 3,100 Total Participants

The 2026 Electrical Wire Processing Technology Expo (EWPTE) brought together the cable and wire harness manufacturing industry for another strong year of innovation, education, and business development, drawing 3,140 total participants to Milwaukee.