The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
On August 22, 2025, the Global Electronics Association hosted the successful “WorksAsia-AI and Factory of the Future Technical Seminar” during the Exhibition “Automation Taipei 2025.”
The Global Electronics Association Launches Design Village at APEX EXPO 2026
APEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced today the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry.
The Wire Association International’s Wire Expo to Co-Locate with the Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026
The Wire Association International Inc. (WAI) announces plans to co-locate its biennial Wire Expo with the Wiring Harness Manufacturer’s Association (WHMA)/Global Electronics Association’s Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026. The two shows will co-locate at the Baird Center, Milwaukee, Wisconsin, USA.
IPC Issues Call for Participation for IPC APEX EXPO 2026
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.
Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees
The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.
Electronics Industry Reimagines the Possibilities at IPC APEX EXPO 2025
The electronics industry is driven by innovators and problem-solvers, and IPC APEX EXPO 2025 provided endless opportunities to connect, collaborate, and shape the future. From hot topics such as artificial intelligence, high performance computing, advanced packaging and EV electronics covered in keynotes, conference sessions and standards meeting to the latest innovations in capital equipment on the show floor, this year’s event provided ample knowledge sharing and networking opportunities, for 3,541 attendees from 39 countries.