WHMA Announces 2027 Annual Global Leadership Summit for Wire Harness Industry Leaders
The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.
Winners of Hand Soldering Competition Vietnam 2026 Announced
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
EWPTE 2026 Demonstrates Continued Industry Growth with More Than 3,100 Total Participants
The 2026 Electrical Wire Processing Technology Expo (EWPTE) brought together the cable and wire harness manufacturing industry for another strong year of innovation, education, and business development, drawing 3,140 total participants to Milwaukee.
Global Electronics Association and FED Call for Abstracts for Pan-European Electronics Design Conference 2027
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
On March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.