For the first time, IPC hosted a regional hand soldering competition in Vincenza, Italy, at Focus on PCB May 17-18. Welcoming 28 competitors representing 20 Italian companies, contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality.

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 6 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments.

IPC hosted a Hand Soldering Competition in Budapest, Hungary, at InnoElectro March 28-30, welcoming 42 competitors from 29 European electronics companies.

Kenneth Harris II, Eng.D. will deliver the opening keynote at Electrical Wire Processing Technology Expo (EWPTE). Acknowledged by Forbes Magazine as one of the world’s youngest and most influential individuals in the field of science, he will present “Building the Future,” on Wednesday, May 17, 2023, at the Wisconsin Center in Milwaukee, Wis.