IPC Issues Call for Participation for the Electronic Circuits World Convention 16 (ECWC16) and IPC APEX EXPO 2024

IPC is now accepting abstracts for technical paper presentations and technical posters for the Electronic Circuits World Convention 16 (ECWC16) at IPC APEX EXPO 2024, and professional development courses at IPC APEX EXPO 2024.

EWPTE, the Cable and Wire Harness Industry’s Exclusive Trade Show Draws More than 3,000 Attendees

This year, the cable and wire harness manufacturing industry came “wired” to the Electrical Wire Processing Technology Expo (EWPTE), May 16-18, and left inspired with access to new technologies, solutions to challenging issues through training and education and a network of leading-edge companies, industry leaders and subject matter experts.

Winners of IPC Hand Soldering Competition at Focus on PCB Announced

For the first time, IPC hosted a regional hand soldering competition in Vincenza, Italy, at Focus on PCB May 17-18. Welcoming 28 competitors representing 20 Italian companies, contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality.

IPC and ITI to Host 2023 Virtual Conference on Critical and Emerging Environmental Product Requirements

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 6 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

IPC Forum: IPC Issues Call for Participation for High Reliability Forum

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments.