M-EXPO Wire Processing Technology 2019 Exceeds Expectations
The third annual M-EXPO Wire Processing Technology event held in Ciudad Juárez, México at the Cuatro Siglos Convention Center on October 9-11, 2019, exceeded expectations. This event was co-located with the ninth annual EXPO-MRO. These two events hosted more than 6,500 attendees.
IPC Hand Soldering Competition Winner Crowned at NEPCON Japan
The 2019 IPC Hand Soldering Competition Japan concluded at NEPCON Japan in Nagoya September 20, celebrating the outstanding skills and professional achievements of talented manufacturing floor workers. Thirty-two competitors from renowned companies such as Panasonic, Mitsubishi Electronics, Advantest, NEC Space Technology and others participated in the event.
IPC Hand Soldering Competition Winner Crowned at What's New in Electronics Live 2019
IPC, in conjunction with What’s New in Electronics Live and ART-- Advanced Rework Technology Ltd., conducted the IPC Hand Soldering Competition in Warwickshire, United Kingdom, on September 18-19, 2019. Twenty competitors demonstrated their soldering skills with the hope of winning the coveted hand soldering competition crown.
M-EXPO Wire Processing Technology 2019 Exhibit Space Sold Out; Wait List Open
Exhibitor booth space at the third annual M-EXPO Wire Processing Technology 2019 in Ciudad Juárez, México, is sold out and wait-list applications are being accepted.M-EXPO 2019 has more than doubled its event space from 2018 and has exceeded expectations by selling out the exhibit space a month before the event. This year’s event is being held on October 9-11, 2019 at the Cuatro Siglos Convention Center, co-locating with the ninth annual EXPO-MRO.
IPC Designs for Excellence in Conjunction with PCB Carolina
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. Will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.