Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards
IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.A panel of industry experts reviewed each product’s submission and chose winners in each category based on the following criteria: How is this product innovative? How is this product changing the manufacturing industry? What value will customers experience with this new product?
Best Technical Papers at IPC APEX EXPO 2020 Selected
The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.
2020 WHMA 27th Annual Wire Harness Conference Exhibit Space is Sold Out
Exhibitor booth space at the 2020 WHMA 27th Annual Wire Harness Conference in Las Vegas, Nevada is sold out. The Wiring Harness Manufacturer’s Association (WHMA) and IPC exceeded expectations by selling out the exhibit space a month before the event. This year’s annual conference broke a 26-year record with 40 booths sold, making it the largest exhibit floor in WHMA’s history.
U.S. Congress to Approve Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications.
IPC Crowns New Hand Soldering World Champion in Munich
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.