David Adams, Collins Aerospace, Earns Dieter Bergman IPC Fellowship Award at IPC SummerCom

In recognition of his ongoing leadership in developing and promoting IPC standards on a global basis, IPC bestowed a Dieter Bergman IPC Fellowship Award upon David Adams, Collins Aerospace, at IPC SummerCom on June 17.

Volunteers Honored for Contributions to IPC and the Electronics Industry

Committee Awards presented at IPC SummerCom

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on Monday, June 17 at IPC’s SummerCom Standards Development Committee Meetings in Raleigh, N.C. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.

IPC/WHMA to Sponsor M-EXPO Show

Established partnership of joint effort to strengthen the wire harness manufacturing industry

IPC and the Wiring Harness Manufacturer’s Association® (WHMA) have joined M-EXPO to offer more value to their supplier and manufacturing members as well as offering cutting edge educational access to the Northern Mexico Maquiladora Wire Processing Industry.

IPC APEX EXPO Named in Trade Show News Network’s Top 25 List of Fastest-growing Shows in Attendance

IPC announces that IPC APEX EXPO® has been recognized by the Trade Show News Network (TSNN) as one of the top 25 fastest-growing trade shows in attendance in the United States. In addition to IPC APEX EXPO, the additional winners were recognized for their overall attendance growth from 2016 to 2018 and include a diverse mix of industries, including amusement parks, baseball and boatbuilders

IPC Issues Call for Participation for Electronics Materials Forum

Presentations sought on emerging technologies

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup

Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.