New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates

Global community of 246 technical specialists develops unified specifications for advanced packaging; core technical requirements to be addressed in Feb. 5 webinar

The Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.

EMC Taiwan Receives IPC-4101 Qualified Products Listing Certification

IPC’s Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Elite Materials Co. (EMC), an electronics base material manufacturing company headquartered in Taoyuan City, Taiwan.

New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability

IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance. IPC-8981 introduces a common framework for evaluating wearables that integrate electronics directly into textile materials—applications that span healthcare, defense, fitness, and consumer technology.

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.

Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG.

New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing

A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs).