Global Electronics Association East Asia recognizes the companies and industry professionals advancing electronics manufacturing and industry standards through the East Asia Awards. This year’s honorees demonstrate a commitment to implementing international standards, strengthening manufacturing capabilities, and contributing technical expertise to the development of IPC standards.

High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

The Global Electronics Association today announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.

Radbon Electronics Co., Ltd. has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.

The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.

The Global Electronics Association has released IPC-A-630A, Requirements and Acceptance for Electronic Box Assemblies, an updated standard providing acceptance criteria for electronic box assemblies