B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference
B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL) and successful science fiction writer, will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego
IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
IPC Names Shawn DuBravac, Global Tech Trends Expert, as New Chief Economist
Today, IPC announced Shawn DuBravac, Ph.D., CFA, will serve as the association’s chief economist. In this role, DuBravac will expand IPC’s research program and provide insights on the biggest issues facing the $2 trillion global electronics industry, including supply chain resiliency/uncertainty, trade wars, skilled workforce shortage, and the expanding role of electronics in the global economy.
IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community
IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
IPC CEMAC 2019 Showcases Intelligent Future Driven by Data
More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.
North American PCB Sales Decline, Following Negative Order Growth
IPC announced today the July 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales growth in July turned negative, following order growth into negative territory. The book-to-bill ratio remained at parity (1.00).