IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board.
IPC Relaunches New Website to Better Serve the Electronics Manufacturing Industry in Mexico and for Spanish Speakers Worldwide
IPC announces the relaunch of its IPC Mexico website, designed to better serve the needs of the electronics manufacturing industry in Mexico and for Spanish-speaking professionals worldwide.
IPC Announces New Board Members at IPC APEX EXPO 2024
At the 67th IPC Annual Meeting on April 9, held in conjunction with IPC APEX EXPO 2024, the IPC Board of Directors announced new officers and new and second-term members.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced pack