As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.

Chief Technology Officer Matt Kelly's top three reads highlight how emerging technologies are reshaping the future of the electronics industry.

AI is being leveraged in manufacturing environments globally in many unique ways to address important concerns and challenges facing all enterprises.

Peter Tranitz, Senior Director of Technology Solutions Europe, shares expert insights on the biggest shifts in the electronics industry, including co-design and simultaneous engineering, AI-powered ECAD/MCAD tools, and digital twins.

At Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.

The Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.

Explore three key reads on how AI is transforming the electronics ecosystem