What does “advanced packaging” mean in the context of semiconductors and electronics manufacturing? And why is it so important to the future of the world? Those are the questions answered in simple language and imagery in a new 90-second video released by IPC.
IPC recently released a new white paper, "Building Electronics Better: A Plan to Address the Workforce Challenges Facing the Electronics Manufacturing Industry." The white paper provides a framework for establishing an industry-wide talent pipeline and career pathways aligned to the needs of both workers and business.
Building a strong workforce means attracting, retaining, and nurturing qualified workers. To achieve these lofty goals, understanding what motivates talent is a must. And career advancement is key.
IPC extends its congratulations to TTM Technologies on securing $30M from the DoD's Manufacturing Capability Expansion and Investment Prioritization (MCEIP) office to equip a new 200,000+ square foot facility in Syracuse, New York. The new facility will dramatically increase domestic production of ultra-high density (uHDI) printed circuit boards (PCBs).
On September 25, Anthesis Group, EarthShift Global, and IPC co-hosted a discussion with systems engineers and life cycle assessors on data challenges for circularizing electronics. We met at the annual American Center for Life Cycle Assessment (ACLCA) conference. The 90-minute session “There’s No End to a Circle…” covered several perspectives on electronics circularity challenges that stem from the lack of reliable, current, and secure industry data.
IPC's recent white paper, "Securing the European Union's Electronics Ecosystem," highlights the importance of strengthening Europe’s electronics supply chain across all levels, from silicon to systems.
On October 3, I gave a talk on the pressing need to establish, refine, and redefine sustainability policy priorities and advocacy activities in close dialogue with the electronics industry in order for this industry to remain competitive in Europe. This was the key take-away of my presentation at the IPC Day Italy event held at the Convention Center of the Ferrari Museum in Maranello, in partnership with Phoenix Contact and GESTLabs.
In this first webinar — Complex Integrated Systems: The Future of Electronics Manufacturing — guest speakers Dan Gamota (NextFlex) and Girish Wable introduced the concept of CIS and discussed current trends.
As we enter the final quarter of 2024, IPC is proud to reflect on a year of significant progress and strategic advancement in our government grants and funding initiatives. Since the program’s launch in July 2023, we’ve explored major funding opportunities, forged key partnerships across the electronics sector, and laid a strong foundation for long-term success. Our efforts this past year are setting the stage for impactful results and future growth.
Congressional staff continue to work behind the scenes in preparation for the post-election final legislative push of 2024.