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Four Things to Know About IPC’s Recently Released “Quality Benchmarks for the Electronics Assembly Industry”

IPC has recently released “Quality Benchmarks for the Electronics Assembly Industry,” a biennial report that compiles and analyzes survey results from over 50 assembly companies, mostly comprised of contract electronics manufacturing service (EMS) companies and original equipment manufacturers (OEMs).

Beyond Moore’s Law – Enabling Heterogeneous Integration and Next Generation Chiplet Architectures

The Hall of Fame Council, key contributors to IPC, and members from diverse backgrounds in electronics manufacturing provide strong backing and support for the IPC effort, with members of the group committed to helping in several ways.

IPC Analysis Shows Leading Companies Are Intentional About Tracking Environmental and Social Risks

Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows.

Secure your Spot at IPC’s Advanced Packaging Symposium, October 11-12

IPC President and CEO John Mitchell invites you to join us in Washington, D.C. for a two-day meeting focused on the opportunities and challenges for next-generation advanced packaging production, public policy updates, commercial and defense electronics industry drivers, current business environment for IC substrates and component assembly and test manufacturing.

IPC, European Parliament Work to Bolster European Chips Act

Last week, Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. 

European Commission Publishes Proposal on Prohibiting Products Made with Forced Labour

IPC is monitoring a proposal recently published by the European Commission (EC) that would prohibit products in the European Union market made with forced labour. The current proposed draft would ban both imported goods and goods made in the EU with forced labour.

International PCB Designer Community Steps Up to Compete

Forty-eight printed board designers from around the world have registered to compete in the IPC Design Competition 2023

The U.S. Government Needs to Embrace a Silicon-to-Systems Approach

The bipartisan CHIPS and Science Act of 2022 is launching a new era of leadership for U.S. semiconductor manufacturing and related industries. However, rebuilding the advanced electronics industry in the U.S. will require a long-term, sustained effort, and it is about more than just chips.

CHIPS Act Implementation Must Be About More than Just Chips

The U.S. Government must actively encourage the expansion of the advanced packaging ecosystem, supply-chain partnerships, and industry-backed workforce programs if it wants to succeed in boosting the U.S semiconductor industry under the CHIPS Act.

U.S. Election Results a Mixed Bag for Electronics Industry

The results are in from the recent U.S. federal election, and the impacts on the electronics manufacturing industry are likely to be mixed.

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