In the spirit of reflecting on the year just passed and looking ahead to the new year, here are the highlights of IPC’s government policy advocacy efforts in 2023.
This week, the European Institutions reached provisional agreement on the European Chips Act, paving the way for the region’s introduction of an important framework to build out innovation in the European semiconductor ecosystem and security of supply for Europe’s industries.
IPC this week took part in a European Commission Industrial Forum feedback exercise to identify EU legislation with the heaviest reporting burdens for manufacturers in the European Union. The exercise follows European Commission President Ursula Von Der Leyen’s commitment to simplify reporting burdens and reduce them by 25%.
IPC and Continental Automotive’s HERMES Day Successfully Held at Continental Jingyue Branch in China
To help the industry better address the challenges of Industry 4.0 and transition towards digital intelligent manufacturing, IPC, in collaboration with Continental Automotive China SMT Club and Continental Automotive Electronics (Changchun) Co., Ltd. Jingyue Branch, successfully held HERMES Day at the Jingyue Factory on August 16.
IPC is advocating for a 13.5-year minimum transition period to the European Chemical Agency’s (ECHA) proposed restriction on all per- and polyfluoroalkyl substances (PFAS). The ECHA proposal was put forward by five Member States in the European Union (EU) and would ban manufacture, market placement, and use of all PFAS.
The electronics manufacturing industry this week urged U.S. policy makers to take a “silicon-to-system” approach to CHIPS Act implementation and to step up efforts to build a high-skilled workforce for the industry’s needs.
As CES kicks-off the new year in Las Vegas, the world looks forward to learning about the latest breakthrough electronic technologies that will shape our future.
CES 2024 truly showcases the best of electronics innovation for today and tomorrow. It’s exciting to be here. One of my biggest takeaways from today is how absolutely essential it is for the electronics industry to reinforce our commitment to sustainability – sustainability for smart cities and homes, vehicle technology, fitness and wearables.
This afternoon the U.S. Department of Defense (DOD) released a long anticipated National Defense Industrial Strategy (NDIS).
In the intricate world of electronics manufacturing process and precision are not just goals; they are necessities. Amidst the myriad of factors that can affect the quality and reliability of electronic products, one critical issue can go unnoticed – Foreign Object Debris (FOD). Though seemingly insignificant, FOD can have profound implications on the manufacturing process and the end products. This post delves into why managing FOD is pivotal in electronics manufacturing.