Electric vehicles and smart cars have become one of the fastest-growing markets in the electronics industry. With demands for automation, electrification, connectivity, and safety, vehicles are not only integrating more electronic products from various industries, but their quality and reliability must also be enhanced.
With the rapid development of electronic information technology and the continuous drive towards electrification, intelligence, and connectivity in the automotive industry, the landscape of automobile manufacturing is undergoing constant changes.
Join IPC on June 24 at 10:00 am EDT for a special virtual event, "Bold Breakthroughs: Women Reshaping the Engineering Landscape," as we celebrate International Women in Engineering Day (INWED). Our lineup of panelists features nine extraordinary women from nine different countries, each a leader in her own right within the electronics industry.
Join IPC at Global Industrie March 25-28 in Paris, when we will host the IPC Forum, a program covering all aspects of the electronics manufacturing industry. Meet the best experts in the industry presenting on key industry topics.
A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.
Panelists include:
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 - May 1, 2024, at The Westin Arlington, Arlington, VA.
This webinar will focus on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).
USPAE and IPC would like to invite you to participate in an IC substrate workshop planned for May 16, 2024, in Washington, D.C. The workshop will further IPC’s work on a U.S. Department of Defense-funded project to study and recommend approaches to addressing the country’s lack of IC substrate manufacturing capabilities.
Explore the world of PCB Board Fabrication and discover the journey of design artwork once it’s dispatched to the board shop. This comprehensive webinar provides insights into the process, making it a valuable resource for Electrical Engineers, PCB Layout Professionals, Supply Chain personnel, and anyone interested in PCB Board Fabrication. In this webinar, we’ll cover:
- Design and layout
- Material selection
- Drilling, imaging, and etching processes
- Plating and finishing
- Solder Mask materials and application
- Silkscreening
- Cost Drivers
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue.