Introduction to PCB Design I and II are two online IPC courses dedicated to PCB design, scheduled for the next few months. The courses are held by Pietro Vergine, co-president of Leading Edge and IPC instructor.
Last week, IPC, ITI, and the Anthesis Group partnered to host an informative one-hour webinar aimed to demystify the complexities of the EU Corporate Sustainability Due Diligence Directive (CSDDD) for the electronics manufacturing industry.
IPC celebrates Workforce Champions. Tell us your story.
PRIDE Industries is the United States’ leading employer of people with disabilities and those with other barriers to employment, including veterans and former foster youth.
On a news-filled day at the Department of Commerce, IPC CEO John W. Mitchell hosted the agency’s chief export enforcement officer to speak candidly with members.
The latest EU Competitiveness Report, authored by former European Central Bank President Mario Draghi and released this month, is a compelling call to action that should serve as a framework for policy action in Brussels and capitals across Europe.
What does “advanced packaging” mean in the context of semiconductors and electronics manufacturing? And why is it so important to the future of the world? Those are the questions answered in simple language and imagery in a new 90-second video released by IPC.
IPC recently released a new white paper, "Building Electronics Better: A Plan to Address the Workforce Challenges Facing the Electronics Manufacturing Industry." The white paper provides a framework for establishing an industry-wide talent pipeline and career pathways aligned to the needs of both workers and business.
Building a strong workforce means attracting, retaining, and nurturing qualified workers. To achieve these lofty goals, understanding what motivates talent is a must. And career advancement is key.
IPC extends its congratulations to TTM Technologies on securing $30M from the DoD's Manufacturing Capability Expansion and Investment Prioritization (MCEIP) office to equip a new 200,000+ square foot facility in Syracuse, New York. The new facility will dramatically increase domestic production of ultra-high density (uHDI) printed circuit boards (PCBs).