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IPC Electronics Forum @ electronica

IPC booth #A1-465

Optimizing Cleaning Products Used in Electronics Manufacturing

IPC, in collaboration with ChemFORWARD, welcome a variety of electronics manufacturing companies including electronics cleaning product formulators to attend this webinar to: Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.

Assessing Electronics with Advanced 3D X-ray Microscopy Techniques

This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc. Key discussions include: • Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise. • DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area. These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.

Designing for Success: How DFM, DFT, and DFA Impact PCB Production

This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected. We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors. Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs. This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!

IPC Hand Soldering Competition 2025 Regional Qualification - United Kingdom

Join the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) at Farnborough International Exhibition Centre on 4-6 February 2025. Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Crosswinds & Crises: Navigating the Economic Crossroads of 2025

Join IPC on April 29 at 10:00 AM EST for Crosswinds & Crises: Navigating the Economic Crossroads of 2025, a free live session led by IPC Chief Economist Dr. Shawn DuBravac. This critical update will offer insights into the risks, opportunities, and evolving dynamics shaping the economic landscape.

IPC 攜手 TEEMA、III 共建 EMS 智慧製造 AI 資料庫,簽署策略合作備忘錄(MOU)

IPC 攜手 TEEMA、III 共建 EMS 智慧製造 AI 資料庫,簽署策略合作備忘錄(MOU)

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

A Technology Solutions Webinar Series for e-Mobility Electronics Hardware Reliability

We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.

PCB Troubleshooting & Defect Analysis

Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

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