IPC, in collaboration with ChemFORWARD, welcome a variety of electronics manufacturing companies including electronics cleaning product formulators to attend this webinar to: Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.
This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc.
Key discussions include:
• Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise.
• DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area.
These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.
This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected.
We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors.
Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs.
This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!
IPC 攜手 TEEMA、III 共建 EMS 智慧製造 AI 資料庫，簽署策略合作備忘錄（MOU）
Electronics Manufacturing & Packaging Symposium (EMPS) 2025
We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.
USPAE and IPC would like to invite you to participate in an IC substrate workshop planned for May 16, 2024, in Washington, D.C. The workshop will further IPC’s work on a U.S. Department of Defense-funded project to study and recommend approaches to addressing the country’s lack of IC substrate manufacturing capabilities.
Explore the world of PCB Board Fabrication and discover the journey of design artwork once it’s dispatched to the board shop. This comprehensive webinar provides insights into the process, making it a valuable resource for Electrical Engineers, PCB Layout Professionals, Supply Chain personnel, and anyone interested in PCB Board Fabrication. In this webinar, we’ll cover:
- Design and layout
- Material selection
- Drilling, imaging, and etching processes
- Plating and finishing
- Solder Mask materials and application
- Silkscreening
- Cost Drivers
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue.
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue.