Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.
This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.
Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.
Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.
When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.
Join IPC at Global Industrie March 25-28 in Paris, when we will host the IPC Forum, a program covering all aspects of the electronics manufacturing industry. Meet the best experts in the industry presenting on key industry topics.
A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.
Panelists include:
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 - May 1, 2024, at The Westin Arlington, Arlington, VA.
This webinar will focus on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).
Presentation on Best Practices of Electronics Assembly
IPC skills competition will be upgraded to IPC Electronic Assembly Masters, namely IPCMasters Competition China 2023.
Using the IPC APEX EXPO Technical Conference as a model, this webinar will provide an overview of best practices for preparing technical data to write a high-quality manuscript suitable for conference presentation and publication. This tutorial is designed for anyone who wants to build their technical writing skills and share their innovations and research with a technical audience, and will have a special focus on the electronics industry. The session will highlight important advanced preparations prior to submitting an abstract or paper that should be considered by the author and their management. Using the style guideline created for ECWC16/IPC APEX EXPO 2024, attendees will receive an overview of the mechanics, format, and outlines used for an effective technical paper and presentation. Also covered will be how to avoid commercialism and common pitfalls that lead to inefficiencies and reduced quality. Time will be made available at the end of the presentation for questions and answers. IPC encourages anyone interested in writing technical papers to attend this free webinar.