BACK BY POPULAR DEMAND -- John Watson explores how artificial intelligence (AI) is revolutionizing printed circuit board (PCB) design in this must-attend webinar, "The AI Advantage in PCB Design: Tools and Trends." This session will provide a deep dive into the transformative impact of AI on the PCB design process, helping engineers and designers tackle challenges with greater efficiency and innovation.
The webinar begins with an introduction to AI's fundamental role in modern PCB design. Participants will learn how AI enhances traditional workflows, offering capabilities beyond human limitations. From circuit optimization to error reduction, AI enables faster, smarter, and more precise design outcomes.
Through real-world examples, the session will highlight how AI is being used to solve common PCB design challenges, such as managing complex routing patterns, improving thermal performance, and reducing the time spent on iterative design revisions. These case studies will show how companies have integrated AI to address bottlenecks, reduce costs, and accelerate product development timelines.
Additionally, this webinar will explore the potential hurdles of adopting AI technologies in PCB design. Topics will include data preparation, the need for effective collaboration between engineers and AI systems, and the importance of validating AI-driven recommendations. Attendees will also get a glimpse into the future of AI in PCB design, including its role in fully autonomous design systems and its integration with next-generation technologies like augmented reality (AR) and virtual reality (VR).
What Participants Will Learn
1. How AI is transforming the design process in general.
2. The benefits of using AI are in improving efficiency and accuracy.
3. Key features and capabilities of AI-powered tools.
4. Real-world examples of AI solving design challenges.
5. Common challenges when adopting AI technologies.
6. Exciting future possibilities for AI in design and engineering.
IPC Design Day France 2025, IPC Designers Council France, proposed event taking place on April 3-4, 2025 at Hotel Pullman Aeroport Toulouse, France
IPC is teaming up with the U.S. Partnership for Assured Electronics (USPAE) to offer an expert-led discussion on the legal risks related to compliance with the Cybersecurity Maturity Model Certification (CMMC). This discussion will be held on November 19 at 1pm ET and will be led by Eric Crusius, a Partner at Holland & Knight.
IPC booth #A1-465
IPC, in collaboration with ChemFORWARD, welcome a variety of electronics manufacturing companies including electronics cleaning product formulators to attend this webinar to: Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.
This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc.
Key discussions include:
• Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise.
• DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area.
These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.
This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected.
We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors.
Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs.
This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. The discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends with unique takeaways.
Join us for an inspiring webinar, “A View from the Top: Succeeding as Women Engineers in Microelectronics,” where we celebrate the achievements of two remarkable women in the electronics industry, Cheah Soo Lan, Master IPC Trainer for CID/CID+ and Despina Davis, Ph.D. This event features insightful interviews with trailblazing professionals who have excelled beyond engineering roles. Additionally, our speakers will introduce new IPC online instructor-led courses, including A Technical Overview of the Semiconductor Chip Industry—perfect for those new to semiconductor topics, offering a gateway to new career opportunities and enhanced expertise. Also, discover the intricacies of Microvia Electroplating, where you’ll learn essential techniques and best practices for reliable microvia fabrication in high-density interconnects. Don’t miss this opportunity to gain valuable insights and advance your career!
We are delighted to welcome Dr. Habib Mustain of Hereaus to discuss power electronic substrate types, requirements, and challenges for today's EV applications.