We are delighted to welcome Brian O'Leary of Indium to discuss the impact of the Software Defined Vehicle on hardware design and manufacture.
We are delighted to welcome expert panelists to discuss what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top 3 challenge areas beyond current regulatory reporting and what may be coming next.
IPC Day EMS Europe - Gdansk, Poland - Wednesday, 25 September 2024
The Corporate Sustainability Due Diligence Directive (CSDDD) is a European Union directive that introduces legal obligations on businesses to respect human rights and the environment.
Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to share industry pain points and solutions.
IPC 攜手 TEEMA、III 共建 EMS 智慧製造 AI 資料庫，簽署策略合作備忘錄（MOU）
Electronics Manufacturing & Packaging Symposium (EMPS) 2025