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Characterization of IC Chip Package IBIS Model and Signal Integrity

This one-hour webinar presents an insight into the PCB Signal Integrity simulation and IBIS model characterization process. A review of what exactly signal integrity simulation does on the PCB and at the system level. A discussion on how the IBIS model is a default for analyzing IC Chips’ input/output waveform integrity. The IBIS model is broken down for easier understanding of its operation and integration into the SI simulation. In addition, a quick note on how to achieve accurate results for Signal Integrity simulation.

Europe's Electronics Industrial Strategy: Leadership or Dependence?

23 June 2026 · Renaissance Brussels Hotel · Brussels, Belgium

Onshoring Advanced Packaging and Assembly Workshop

An IMAPS/Global Electronics Association workshop focused on increasing domestic microelectronics production

IPC Releases PCB Industry Results for August 2020

August 2020 book to bill ratio from North American Printed Circuit Board Statistical Program.

IPC Releases New “H” Revision to Two Leading Standards for Electronics Assembly, IPC J-STD-001 and IPC-A-610

IPC has released H revisions of two leading standards for the electronics assembly industry: IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610H, Acceptability of Electronic Assemblies.

IPC and PSMA Form Powerful Partnership, Sign MoU Focusing on Standards Development, Education and Training

IPC and Power Sources Manufacturers Association (PSMA) have signed a Memorandum of Understanding (MoU) pledging to build a strong complementary relationship between the two entities with a focus on standards development, education and training.

UPDATE: SCIP Database Requirements May Apply to Your Company

ECHA formally launches the Substances of Concern in Products (SCIP) database.

IPC E-Textiles Europe 2020 | Virtual Summit Highlights E-Textiles Labs in Four Countries in Two Days

IPC E-Textiles Europe 2020 | Virtual Summit, a two-day technical education conference for innovators, technologists, and brands/OEMs, will provide a platform for education and collaboration among professionals interested in producing e-textiles technologies and products.

IPC Issues Statement on NDAA Provisions Aimed at Bringing Resiliency and Security to Supply Chains

IPC supports the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA).

EU Leaders Working on New Corporate Due Diligence Requirements

Last April, European Justice Commissioner Didier Reynders announced he is planning in 2021 to propose legislation with binding due diligence obligations as part of a broader package on sustainable corporate governance.

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