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Dr. Hans-Peter Tranitz Appointed Senior Director, Solutions at IPC Electronics Europe GmbH

IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. In this role, Dr. Tranitz will focus on IPC global initiatives including automotive electronics, advanced packaging, and Factory of the Future as well as serving as a technical resource for regional activities in Europe.

IPC APEX EXPO Recognized as a Top Trade Show in the United States by Trade Show News Network

IPC announces that IPC APEX EXPO has been recognized by the Trade Show News Network (TSNN) as one of the top 250 trade shows in the United States coming in at number 112 for 2019. This marks a jump from 2018’s ranking of 121. In addition, IPC APEX EXPO was recognized last November as the fastest-growing association show for attendance in the United States for years 2016-2018.

Chemical Reporting for Article Products and IPC-1754

Obtaining data from the supply chain to support chemical (“substance”) content reporting for article (hardware) products remains extremely challenging and resource-intensive for industries such as Aerospace and Defense (AD). However, the increasing use of materials and substances declaration standards promotes efficiency in obtaining such data. IPC and IAEG® (International Aerospace Environmental Group) encourage the use of IPC-1754, Materials and Substances Declaration for Aerospace and Defense and Other Industries in the AD industry and its global supply cha

IPC Crowns New Hand Soldering World Champion

IPC’s hand soldering competition returned to the United States with the first-ever IPC Hand Soldering World Championship and Rework Competition, held at IPC APEX EXPO 2019 in San Diego, California. Contestants representing Britain, China, France, Germany, India, Indonesia, Japan, South Korea, Vietnam and Thailand participated in the event.

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss "the next big thing" in CHIPS Act implementation: expanding "advanced packaging" capacities and capabilities to go along with expanding production of semiconductor chips.

IPC and Automotive Industry Action Group Enhance Partnership Agreement

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.

Attendees can Meet, Greet, Connect and Expand their Network at IPC APEX EXPO 2023

IPC APEX EXPO 2023 attendees can meet with electronics industry innovators and connect with peers all in one place at the San Diego Convention Center, January 21–26, 2023.

Winners of IPC Hand Soldering Competition at Instrutec 2022 Announced

In conjunction with Instrutec 2022 and the Estonian Electronics Industries Association, IPC hosted its popular IPC Hand Soldering Competition in Tallinn, Estonia October 12-14, 2022, welcoming 31 competitors from 14 European electronics companies.    

Registration and Sponsorships Open for IPC E-Textiles 2020 Virtual Summit

Registration is now open for IPC E-Textiles 2020 Virtual Summit, to be held Thursday, October 1 and Friday, October 2. IPC E-Textiles 2020 Virtual Summit will consist of two 90-minute interactive educational workshops each day, as well as a live tour of the University of Minnesota Wearable Technology Lab.

USPAE Entering Rapid Growth Phase to Better Connect Industry, Government

The U.S. Partnership for Assured Electronics (USPAE) is entering a new phase of rapid growth to better connect the electronics industry with government needs and opportunities. Effective immediately, membership dues are reduced to $1,000 for all organizations, and the process to join is streamlined.

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