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IPC and Automotive Industry Action Group Enhance Partnership Agreement

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.                  

IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community

IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.

IPC Names Shawn DuBravac, Global Tech Trends Expert, as New Chief Economist

Today, IPC announced Shawn DuBravac, Ph.D., CFA, will serve as the association’s chief economist. In this role, DuBravac will expand IPC’s research program and provide insights on the biggest issues facing the $2 trillion global electronics industry, including supply chain resiliency/uncertainty, trade wars, skilled workforce shortage, and the expanding role of electronics in the global economy.

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference

B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL) and successful science fiction writer, will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.

IPC APEX EXPO Call for Participation Deadline Extended

IPC has extended the deadline for IPC APEX EXPO 2021 technical conference abstracts to Monday, August 31. Due to travel restrictions by some companies and geopolitical areas, IPC is also accepting proposals for virtual presentations. IPC APEX EXPO 2021 technical conference will take place January 26–28 and professional development courses will run January 23–28.

Electronics Manufacturing Industry Applauds Congressional Actions to Bolster Resiliency and Security of U.S. Defense Electronics Supply Chain

IPC, the global electronics manufacturing association, applauds leaders in the U.S. Senate and House for approving IPC-backed measures that will bolster the resiliency and security of the U.S. defense electronics industrial base. 

North American PCB Industry Sales up 0.8 Percent in June

IPC announced today the June 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.

Emerging Technologies Take Center Stage at IPC Electronics Materials Forum

The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. Will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.

IPC and iNEMI Sign Memorandum of Understanding, Strengthening Collaboration Focused on the Future of Electronics Manufacturing

IPC and International Electronics Manufacturing Initiative (iNEMI), have signed a Memorandum of Understanding (MoU) to collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations.

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