IPC and ANSYS invite engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the High Reliability Forum, to be held May 12-14, 2020 in Baltimore, Md.
For the first time, IPC has formed a task group in Japan. The 7-31 BV-JP IPC J-STD-001/IPC-A-610 Automotive Addendum Task Group held its first meeting on June 14, 2022, to introduce task group members, discuss the IPC Works standards collaboration platform, and create a schedule for future task group meetings.
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
IPC bestowed its highest corporate honors on two IPC member companies, the National Aeronautics and Space Administration (NASA) and Naval Service Warfare Center (NSWC) Crane. During a luncheon at IPC APEX EXPO 2019, the Peter Sarmanian Corporate Recognition Award was presented to NSWC Crane and the Stan Plzak Corporate Recognition Award was presented to the NASA.
More than 100 top executives representing companies in the U.S. electronics manufacturing industry are urging the U.S. Congress to address critical shortcomings in the printed circuit board (PCB) industry and the entire U.S. electronics supply chain.
IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts for IPC E-Textiles 2020 – Virtual Summit, to be held October 1-2, 2020. IPC E-Textiles 2020 – Virtual Summit will provide a platform for presenters and their companies to promote their expertise in e-textiles technologies to key contacts from such industries as fashion design, health and medical, sports and athletics, automotive and military/aerospace.
PC is applauding leaders in the U.S. House and Senate for finalizing the FY2019 National Defense Authorization Act (NDAA) and including a provision on military electronics backed by IPC.Reflecting IPC’s collaboration with Senator Joe Donnelly (D-IN), Section 845 of the bill calls on the Secretary of Defense, in consultation with the Executive Agent for Printed Circuit Board and Interconnect Technology (based at the Naval Surface Warfare Center in Crane, Indiana) and the Director of the Office of Management and Budget (OMB), to prepare a report to Congress by January 2019 on the health of the U.S. defense electronics industrial base. The report will include an examination of the Department’s partnerships with industry and a plan to formalize the long-term resourcing of the Executive Agent.
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on August 30 at IPC’s SummerCom Standards Development Committee Meetings in Milwaukee, Wis. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
The European Commission plans to introduce a “European Chips Act” to provide a European vision and strategy to boost cutting-edge semiconductor manufacturing capacity in the region.