IPC China has officially designated the “IPC HERMES Demo Line” as an DIP production line of Phoenix Contact Asia-Pacific (Nanjing) Co., Ltd. during a ceremony held on April 21.
Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity on Friday, May 8.
The Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association, concluded on January 29–30, 2026, at Hotel Taj Yeshwantpur, Bengaluru, delivering tangible outcomes aligned with India’s electronics manufacturing, defence, and global supply-chain ambitions.
The Global Electronics Association Europe and the International Sustainable Chemistry Collaborative Centre (ISC3) announced a new strategic partnership today, which aims to accelerate innovation and collaboration to address circularity and sustainability challenges across the global electronics value chain.
APEX EXPO 2026 will mark a defining moment for the global electronics industry as the first APEX EXPO since IPC’s rebrand as the Global Electronics Association, underscoring the organization’s expanded mission as the voice of the worldwide $6 trillion electronics industry.
The Global Electronics Association today announced that Martin Scaglione has joined the organization as Chief Operating Officer (COO).
The Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on January 28 and January 30 at IPC APEX EXPO 2019 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.
IPC has revamped its Thought Leaders Program (TLP) an initiative designed to “mine” key industry experts’ insight and knowledge on issues driving change within the electronics industry.