The IPC Education Foundation was formally launched during IPC APEX EXPO 2019. As part of that launch, the Foundation committed to starting scholarship programs to raise awareness and reward educators and students that have interest in the electronics industry and the engineering disciplines. On March 4, 2019, the first two of these scholarship programs were opened to eligible participants.
IPC announced today the December 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
IPC announced today the December 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.19.
Demand in the electronics industry recovered to 100 in December, marking the threshold between contraction and expansion after four consecutive months below this level according to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain Report.
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents. The aim of the PEDC was to create a new European platform for the exchange of information on current developments and trends in electronics design.
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs).
Lead, Educate and Connect - these three words gives the perfect insight into this year’s Wire Harness Conference. Starting with a record high of 50 attendees joining the “First Timers Session” that was led by representatives of WHMA’s Board of Directors; this meeting was to educate the participants on the association and conference, discuss industry topics, and introduce and connect the First Timers with other members throughout the conference.
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance.
In conjunction with Global Industrie/Midest and SNESE, IFTEC and IPC conducted the first regional European qualification for the IPC Hand Soldering Competition in Lyon, France on March 5-8, 2019. The competition was fierce as 32 competitors went soldering iron to soldering iron to compete for the coveted hand soldering competition crown.
IPC, an electronics industry association dedicated to furthering the competitive excellence and financial success of more than 3,000 members worldwide, shared a statement today on U.S. tariffs and their implications on the global electronics industry.