IPC invites technical innovators, students engaged in research, academic researchers, and industry leaders to submit abstracts for technical poster presentations for the 16th Electronic Circuits World Convention (ECWC16) at IPC APEX EXPO 2024.
IPC hosted its popular IPC Hand Soldering & Rework Competition in Nagoya, Japan on October 26-28, 2022. Held for the first time in person since the COVID-19 pandemic, the competition welcomed 24 finalists from 17 electronics companies from Japan. The total number of the competitors exceeded 130; 24 finalists passed the primary and the secondary qualifiers and competed at the final stage.
IPC E-Textiles 2023 will be held Monday, January 23, 2023, in conjunction with IPC APEX EXPO, in San Diego, Calif., at the San Diego Convention Center.
IPC India has announced the 2nd annual Integrated Electronics Manufacturing and Interconnections (IEMI) event scheduled on August 1, 2023 in Chennai, and on August 3, 2023, in Pune, India.
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Registration is now open for the 2023 WHMA 30th Annual Wire Harness Conference, the industry’s only annual global leadership conference for the wire harness manufacturing industry. Geared to wire harness manufacturers, their suppliers and customers, the event will take place in person, February 14-16, 2023, in Albuquerque, New Mexico at the Sandia Resort and Casino.
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 16-18, 2023, at the Wisconsin Center in Milwaukee, Wis.
IPC announced today the October 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.
IPC announced today the May 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.