IPC's Validation Services Program has awarded a requalification of the IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to Interconnect Solutions Company in Fountain Valley, Calif.
In recognition of the need to identify, understand, and address sustainability challenges faced by the electronics manufacturing industry, IPC announces the Sustainability for Electronics Leadership Council.
IPC's Validation Services Program has awarded an IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards Qualified Products Listing (QPL) to Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China.
The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.
IPC has revamped its Thought Leaders Program (TLP) an initiative designed to “mine” key industry experts’ insight and knowledge on issues driving change within the electronics industry.
IPC announced today the February 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.30.
IPC announced today the February 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.
Per IPC’s March 2023 Global Sentiment of the Electronics Supply Chain Report, the last month delivered another month of stable industry sentiment: industry demand appears to remain intact, production holds steady and some labor challenges may be receding.
The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:
IPC welcomes the “presidential determination” that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).