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North American PCB Industry Sales Up 5.4 Percent in November

IPC ha announced the November 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.

EMS North America Industry Report, November 2021

IPC has announced the November 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.43.

Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2024

Registration is now open for Electrical Wire Processing Technology Expo (EWPTE) an exclusive, free-of-charge* event for the electrical wire harness, wire, coil winding and cable processing industries, to be held at Baird Center May 14-16, 2024, in Milwaukee, Wis.

North American PCB Industry Shipments Down 18.3 Percent in December

IPC announced today the December 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.90.

North American EMS Industry Up 1.3 Percent in December

IPC announced today the December 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.20.

Honeywell Aerospace Engineer Christina Rutherford to Deliver Keynote at Electrical Wire Processing Technology Expo (EWPTE)

Christina Rutherford, Advanced Materials & Process Engineer at Honeywell Aerospace Technologies, is set to take center stage at this year’s Electrical Wire Processing Technology Expo (EWPTE) May 14-16 at Baird Center in Milwaukee, Wis. as the keynote speaker.

Demand Remains Positive Among Electronics Manufacturers, Labor Costs Index at Highest Level in Six Months

Sentiment among electronics manufacturers remains positive, despite minor setbacks during January, according to IPC’s February Sentiment of the Global Electronics Manufacturing Supply Chain Report.

North American EMS Industry Up 2.6 Percent in January

IPC announced today the January 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.20.

Foreign Object Debris for Electronics Manufacturing Course Available in Spanish, French and German

IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a “Foreign Object Debris (FOD) for Electronics Manufacturing” course, now available in French, Spanish and German.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.

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Global Electronics Association 
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