IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
A sharp increase in salary budgets and use of flexible hours programs for North American electronics assembly companies are among the findings of a new study published by IPC this week, the 2022 Wage Rate and Salary Study for the North American Electronics Assembly Industry.
Registration is now open for the 2023 WHMA 30th Annual Wire Harness Conference, the industry’s only annual global leadership conference for the wire harness manufacturing industry. Geared to wire harness manufacturers, their suppliers and customers, the event will take place in person, February 14-16, 2023, in Albuquerque, New Mexico at the Sandia Resort and Casino.
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 16-18, 2023, at the Wisconsin Center in Milwaukee, Wis.
IPC's Validation Services Program has awarded an IPC-4103 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.
IPC announced today the October 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.
IPC announced today the October 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.
IPC announced today the May 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.
The Wiring Harness Manufacturing Association is accepting nominations for three recognition awards — Hall of Builders, Hall of Fame and Volunteer Excellence.